- Product name：昆山Thermal Pad
- Classification：昆山Thermal Pad
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Thermal conductive silicon film is used to fill the air gap between the heating device and the heat sink or metal base. Its flexibility and elasticity make it be used to cover very uneven surface. Heat is transferred from the separation device or the whole PCB to the metal shell or diffusion plate, which can improve the efficiency and service life of heating electronic components.
L product density: 1-3.1g/cm3
L hardness: 20-60 shore type C
L thermal conductivity: 1.5 ~ 6W
L flame retardant: v0
Application: radiator bottom or frame, high speed hard disk drive, RDRAM memory module, communication hardware, automobile engine control device, LED lighting, etc
Website：http://www.nwtgx.cn/en/product/652.html
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